日本技術士会経由で台湾から専門技術セミナーの依頼があった。タイトルは「窒化アルミの基板への応用」である。リモートでセミナー講師をやるので、飛行機不要で助かる。聴衆は半導体関係者である。資料は過去の蓄積が十分にあるので編集すればいい。
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